Harman Recruitment 2021: Harman schedule to hire Associate Engineer for 2021. The location of the job is Bangalore. The detailed eligibility criteria and application process are given below.
About: Harman International Industries, Incorporated, commonly known as Harman, is an American company that designs, engineers and produces connected products for automakers, consumers and enterprises worldwide, including connected car systems, audio and visual products, enterprise automation, and connected services.
Harman Recruitment 2021:
| Company Name | Harman |
| Company Website | www.harman.com |
| Qualification | BE/ BTech (CS/IT/IS/Electronics/E&C/E&TC/E&I) |
| Job Role | Associate Engineer |
| Experience | Freshers |
| Salary | 5 LPA |
| Job Location | Bangalore |
Required Skills/ Qualification:
– Educational qualification for this job is BE/ BTech (CS/IT/IS/Electronics/E&C/E&TC/E&I)
– Harman is looking to hire freshers for the position of Associate Engineer
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– Freshers should be from 2021 Batch
– Good pH Score
– Freshers should have good Academic record (6 GPA or 65% throughout)
– Freshers should have good knowledge on C++
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– Must have experience with algorithms/data structures knowledge
– Must have Good OOP knowledge
– Software development lifecycle experience.
– Experience with any of these OS architecture, Android/ OS X/ IOS, Windows OR LINUX.
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– Must possess excellent English written/spoken communication skills
– Last date to apply for this job opening is 10th June 2021
– Online test will be conduct on 12th June 2021
– Drive Location will be online
– Interview Process: Online Test, Technical Interview, HR Discussion
– Interested and eligible candidates apply as soon as possible, shortlisted candidates will get interview call letter
Off Campus Hiring 2021 Application Process:-
All candidates who wish to apply for the Recruitment 2021, they may apply for the job post of by clicking on this link
Apply Link: Click here
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The post Harman Recruitment 2021 | Associate Engineer | Bangalore appeared first on Fresher Openings.
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